Bonded Screen Removal Tool - Alroc CWB
from only £141.83 Ex VAT
Alroc Bonded Screen Removal Tool CWB/18-60-MVS
This tool enables the user to remove and chamfer the bonded semiconductor in a clean and swift manner without the use of silicon
- Tool to remove bonded semiconductor with chamfer on the semiconductor cutback
- The blade is adjustable from 0.4mm to 1.4mm with “clicking knob” (0.1mm for each click)
- The angle of the chamfer is 8°
- Tool will accommodate insulation
