Alroc Bonded Screen Removal Tool CWB/18-60-MVS

This tool enables the user to remove and chamfer the bonded semiconductor in a clean and swift manner without the use of silicon

• Tool to remove bonded semiconductor with chamfer on the semiconductor cutback
• The blade is adjustable from 0.4mm to 1.4mm with “clicking knob” (0.1mm for each click)
• The angle of the chamfer is 8°
• Tool will accommodate insulation